E-Align25

E-Align25

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E-Align25 is developed specifically for applications in printed electronics requiring fine pitch Surface Mount Technology . The fine pitch enables bonding of the smallest SMDs and DFN and QFN surface mount package styles. RFID | Microcontroller | Printed electronics The unique material qualities makes it ideal in many applications. With its softness, room temperature adhesive application and high operational temperatur range E-Align25 enables our customers to re-invent their products and manufacturing processes. Currently under developent, set to launch Q3 2024. Engineering samples are available.
CondAlignCondAlign provides groundbreaking conductive films for bonding electronics and thermal transfer CondAlign develops, manufactures, and delivers ground-breaking material technologies that empower our customers to create innovative, high-performing, and more sustainable products for the future—reducing costs, conserving energy, and minimizing the use of precious resources. Our vision at CondAlign is to become the preferred supplier of sustainable, functional films that enable the development of cutting-edge, environmentally friendly products across various industries. We are committed to driving innovation while contributing to a greener, more resource-efficient future.

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