XTPL - Enabling Next-Level Interconnect Density with Ultra-Precise Dispensing

The relentless push toward extreme miniaturization in modern microelectronics demands deposition technologies capable of unprecedented precision and versatility. This presentation will outline recent progress in Ultra-Precise Dispensing (UPD) advancement, particularly to achieve class-leading reliability and easy industrial integration for next-generation manufacturing.

At the forefront of these advancements is UPD’s capability to form robust, High-Performance Interconnections with feature sizes as small as 1 μm. Bridging the gap between standard inkjet technologies and complex photolithography, our maskless technology excels in dispensing of a diverse range of nanoparticle-based, highly conductive inks, including silver, gold, and copper, as well as dielectrics and functional materials. By masterfully handling these highly concentrated materials, UPD enables the precise routing of micrometer-scale conductive traces across highly demanding 3D substrate topographies, overcoming the fluidic and structural constraints of conventional printing methods.

Leveraging these advanced interconnection capabilities, the presentation will demonstrate how UPD provides a transformative approach to Open Defect Repair (ODR) to salvage complex, high-value architectures across three demanding sectors: ultra-fine redistribution layers (RDLs) in advanced semiconductor packaging, Ultra High Density Interconnect (UHDI) PCBs, and next-generation high-resolution displays. By seamlessly restoring broken circuits and filling in open-circuit defects at the micrometer scale, UPD maximizes production yields, drastically reduces electronic waste, and drives scalable solutions for industrial printed electronics.