SINTERED NANO-SILVER PASTE
Products
Information
Low-temperature sintering silver paste offers excellent electrical and thermal conductivity, high bonding strength, fatigue resistance, simple processing, and cost-effectiveness.
PRODUCT FEATURES
1，For chips smaller than 5mm x 5mm, virtually pore-free; for chips larger than 5mm x 5mm, pore rate less than 3%.
2，Utilizes a fully sintered system, free from resin after sintering, exhibiting exceptional sintering properties with a thermal conductivity of up to 120W/m·K.
3，Excellent operability due to high piezoresistive effect (6-9), allowing for continuous dispensing for 24 hours.
4，Strong bonding strength on silver, gold (nickel-palladium-gold, nickel-gold), and other surfaces.
