DIE ATTACH PASTE
Products
Information
Die Attach Paste is a modified epoxy conductive silver adhesive, suitable for the packaging and bonding of semiconductor devices.
The product dispenses smoothly, maintains its shape well, has high bonding strength, and exhibits excellent thermal and electrical conductivity with reliable performance.
PRODUCT FEATURES
1，High piezoresistive effect
2，Extended operability time
3，Smooth dispensing with no tailing or stringing
4，Non-collapsing, non-spreading adhesive dots with excellent shape retention
