SILVER-COATED COPPER PASTE
Products
Information
The silver-coated copper paste reduces silver consumption and establishes an efficient high-speed electron transmission system by introducing a leaf vein structure to lower gate electrode density.
Simultaneously, our proprietary surface encapsulation technology addresses copper oxidation issues without compromising conductivity, sustaining reliability in damp heat environments for over 3000 hours.
PRODUCT FEATURES
·Uniform particle size
·Excellent dispersion
·High oxidation resistance temperature
·Good electrical conductivity
APPLICATIONS
·Silver paste for heterojunction solar cells
·Conductive inks
·Conductive adhesives
·Thin film switches.
