Stretch release tape for residue-free removal

Stretch release tape for residue-free removal

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Bond & Detach® is an extraordinary adhesive technology used for demanding bonding applications that provides the option to be removed residue-free by stretching. The unique and patented technology was developed by tesa and offers the possibility of simple and secure reworkability during the entire product life cycle of an electronic device – from production to end of life. Besides that the whole Bond & Detach® assortment provides very good impact resistance and bonding strength, even on LSE substrates.

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