University of Glasgow | REACT Centre - Sustainable Electronic Materials for Wireless: Advanced Packaging to E-Textiles

We will introduce end-to-end examples of material development for sustainable electronics, targeting high-end wireless, RF/microwave, and power devices sectors. On a board (PCB)-level, we demonstrate how commercially-available biodegradable PCBs could support RF transmission despite their dielectric losses. Moving to semiconductor packages, we will show low-loss and high-resolution (5 um) deposition methods suitable for multi-layered RF interposers operating beyond 170 GHz. Transferred to wearable applications, example modular e-textiles using recyclable materials and reusable ICs will be shown. The demonstrations show that sustainable materials and deposition methods do not affect performance, and that high-power, high-frequency components could transition to a near-zero-waste, low-carbon, fabrication flow, driven by life cycle assessments (LCAs).