This talk presents a method to manufacture elastic multilayer printed circuits in a sheet-based process. The concept is based on stacking pre-perforated thermoplastic polyurethane (TPU) films on top of each other, screen-printing and curing conductive circuits with filled vias, and laminating the material stack together layer by layer. Such a multilayer circuitry can be incorporated with electronics for application-specific functionality by surface mounted devices on top the laminate. Potential application schemes for EMPCs include sensitive and interference tolerant elastic circuits, mixed signal systems and microstrip structures for RF applications.
