TracXon - Scaling Roll-to-Roll Flexible Hybrid Electronics: From Patented VIA Fabrication to Mainstream Manufacturing

Each year, 10s of billions of IoT devices are manufactured. This number is expected to increase to 100s of billions of devices per year, with a greater demand on sensing and processing hardware. There is still a strong dependence on decades-old PCB technology, which is infrastructure- and resource-intensive. The time is right for a disruptive technology that not only scales, but is also sustainable.

TracXon's roll-to-roll flexible hybrid electronics (FHE) technology produces multi-layered circuitry 10x faster than the current PCB technology. Being additive and utilizing recyclable substrates, it results in 5x lower CO2 emission and 10x lower material consumption, making it highly scalable yet responsible. By the reduction of production steps, a significant production cost down is achieved.

A key enabling technology that will usher the transition from PCB to FHE is VIA printing. At TechBlick USA, TracXon unveils the industry's first roll-to-roll VIA printer that enables double-sided circuitry on flexible and stretchable substrates. This presentation covers the specifications, USPs, pilot cases and the commercialization timeline of this patented equipment solution.