NextFlex - Manufacturing Readiness for Hybrid Electronics

The Future of Electronics RESHAPED USA June 2026
TechBlick Event

Information

Hybrid electronics are rapidly maturing, unlocking new levels of performance, integration, and design flexibility across a growing range of applications, yet opportunities to improve manufacturability, qualification, reliability, and scalable production are still ahead. This presentation highlights key industry-driven manufacturing challenges identified through NextFlex roadmapping, including the need for standardized data, validated qualification pathways, and robust process control for distributed manufacturing. Emphasis is placed on enabling technologies such as high-reliability printed interconnects, advanced materials, conformal RF systems, and integrated sensing for extreme environments. The discussion connects these technical needs to dual-use applications in defense and commercial sectors, outlining pathways to accelerate transition from innovation to deployment through improved validation frameworks and cross-sector collaboration.

Biography
Dr. Gamota has more than 25 years of experience in innovation, engineering, and manufacturing and leading major companies in the fields of microelectronics, advanced packaging, complex integrated systems, and hybrid electronics. Most recently, Dr. Gamota was VP at Jabil where his global teams provided innovation & engineering services as well as scalable manufacturing operations to SMMs and Fortune 250 companies. He was previously with Motorola, where he served as director and fellow of the technical staff collaborating across the semiconductor, packaging, components, and manufacturing business units to commercialize automotive, communications, industrial, and government & public safety products.
He is well-known for leading R&D and collaborative innovation teams. In addition, Dr. Gamota has led several multi-member microelectronics systems solutions development programs (DARPA, NIST ATP, etc.) He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council. Dr. Gamota is also active in and has chaired committees developing microelectronics, advanced packaging, and hybrid electronics guidelines, standards, and roadmaps for IEEE, iNEMI, IPC, IEC, A*STAR, and SEMI. Dr. Gamota was elevated to a NextFlex Fellow, IEEE Fellow, and was named a Dan Noble Fellow at Motorola for his contributions and leadership. He holds a Ph.D. from the University of Michigan and an MBA from Northwestern University.
Dr. Gamota’s first notable efforts in the hybrid electronics sector came in 1999 at Motorola – high density, thin memory die array on a flexible substrate for wireless streaming of encrypted video to a handheld communications product.
NextFlexNextFlex is the nation’s leading hub for hybrid electronics, dedicated to accelerating innovation from concept to real-world deployment while strengthening U.S. manufacturing and national security. Its mission goes beyond advancing new technologies, it ensures they are manufacturable, scalable, and ready for impact in both defense and commercial markets. By bridging the gap between research and production, NextFlex enables faster, lower-risk transitions from the lab to operational systems. As a Department of War-sponsored Manufacturing Innovation Institute, NextFlex brings together government, industry, and academia to address a critical challenge: moving breakthrough electronics into practical use more efficiently. Its work is anchored in three core areas of impact—accelerating innovation, strengthening the industrial base, and developing a skilled workforce. This integrated approach allows NextFlex to serve as both a collaborative platform and a hands-on commercialization partner, turning ideas into deployable capabilities. Central to this model is NextFlex’s national consortium of more than 200 members and partners. This ecosystem fosters cross-sector collaboration and provides access to cost-shared research and development, technical manufacturing roadmaps, and a broad network of expertise. Members benefit from alignment with Department of Defense priorities and emerging market needs, ensuring their innovations are both relevant and impactful. Through this structure, NextFlex helps reduce technology transition timelines by up to 50%, accelerating development while ensuring solutions are secure, scalable, and production ready. In addition to collaboration, NextFlex offers direct support through its Technology Hub, delivering end-to-end product development services. From advanced design and prototyping to validation and pilot manufacturing, the organization works closely with partners to refine system architectures, integrate materials, and ensure performance and reliability. This early focus on manufacturability reduces cost and risk, enabling smoother scaling to production. NextFlex also strengthens the U.S. industrial base by connecting organizations across the full value chain. It supports startups and small-to-medium enterprises in entering supply chains while increasing their visibility to federal agencies and key stakeholders. Alongside this, its workforce development programs—spanning K–12 engagement, technical training, and upskilling—help build the talent needed to sustain innovation. Ultimately, NextFlex transforms innovation into impact, turning technologies into deployable systems, prototypes into products, and partnerships into market opportunities—faster, smarter, and together.

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