Komori America Corporation - High-Resolution Gravure Offset Printing in Printed Electronics: Process Control, Applications, and Manufacturing

The Future of Electronics RESHAPED USA June 2026
Masterclass

Information

This masterclass provides a general technical overview of gravure offset printing, including its working principle, key process steps, and main application considerations. The session will explain how gravure offset differs from conventional gravure printing and discuss the factors that influence print quality, consistency, and material compatibility.
The talk will also review the general advantages and limitations of the process, along with common application areas and important considerations related to plates, blankets, pattern design, and process parameters. The objective is to provide attendees with a clear understanding of gravure offset printing as a manufacturing and development method for high-quality patterned deposition.
Komori America CorporationKomori and Seria Corporation: Driving Innovation in Printed Electronics Seria Corporation has been a pioneer in printed circuit board (PCB) technology for nearly five decades, delivering the trusted SERIA brand of advanced screen-printing machines. Known for their precision, durability, and environmentally conscious design, Seria’s solutions meet the highest standards in quality, cost-efficiency, and safety. In 2014, Seria joined Komori Corporation, a global leader in printing technology. This strategic partnership has empowered both companies to expand their innovation footprint across printed electronics and semiconductor packaging. With a dedicated U.S. office offering responsive support, Komori/Seria now provides a robust portfolio of specialized equipment designed for both high-volume production and advanced R&D environments: Additive Manufacturing Equipment for R&D and Production Delivering high-precision, versatile systems tailored for both research laboratories and full-scale manufacturing. These solutions enable rapid innovation and prototyping in advanced electronics and material development. PE Gravure Offset Printing: Pioneering fine-line wiring, bump printing, and fanout technologies—offering scalable, sustainable solutions for semiconductor packaging, MicroLED displays, and other advanced applications. Fine & Selective Filling Printing Technology: Supporting next-generation semiconductor and PCB manufacturing, including HDI, UHDI, and interposer production, through highly selective, precision material deposition. High-Speed Screen-Printing Technology: Designed for gapless alignment and high-throughput efficiency in mass production of MLCCs, RFID tags, and other high-volume electronic components. These integrated technologies are shaping the future of printed electronics, delivering competitive advantages across automotive, consumer electronics, medical, aerospace, and IoT industries. As part of Komori, Seria remains true to its guiding philosophy: "Kando Beyond Expectations!" Together, they are redefining what's possible in printed and additive manufacturing, enabling flexible, cost-effective, and sustainable solutions across a broad spectrum of electronic applications.

Join the event!

See all the content and easy-to-use features by logging in or registering!