A combination of laser and chemical processes enables a direct writing method for high adhesion 1 µm Cu traces. With ultrashort pulsed laser processing, any dielectric substrate can be selectively plated with copper at high resolution, down to 1 µm. A chemical bond between the substrate and copper created by SSAIL technology results in trace adhesion of 6 - 30 N/mm2. Traces of electroless plated copper has a good conductivity and surface roughness, suitable for high power and high frequency applications.
