DoMicro BV - Transparent touch application using PEDOT

DoMicro BV - Transparent touch application using PEDOT

Thursday, December 11, 2025 1:15 PM to 1:35 PM · 20 min. (Africa/Abidjan)
Innovation Day December 2025
TechBlick Event

Information

Printed electronics often involve touch applications on flexible transparent films, which creates a demand for transparent conductive materials. Integration of ICs enables the control of capacitive touch functionality, combined with serial communication protocols such as I2C or USB. This allows for much smaller and more efficient connections than traditional solutions using bulky cables. DoMicro is capable of making Flexible Hybrid Electronic touch applications with screen-printed transparent PEDOT electrodes, inkjet printed silver circuitry and Anisotropic Conductive Adhesive (ACA) bonded components. This presentation focusses on the integration processes of printed transparent conductive polymer polyethylene dioxythiophene (PEDOT:PSS).
DoMicro BVIMAGINE, CREATE, ACCOMPLISH - micro assembly technologies/application solutions DoMicro embarks upon business opportunities in the emerging field of flexible hybrid electronics (FHE). At the forefront of innovation we aim for innovative industrial processes and technologies for applications in FHE and micro devices. Supported by prototyping, service integration and micro assembly, this will bring your ideas from innovation into industrialisation. DoMicro excells in developing cutting edge inkjet printing processes, micro assembly and 3D packaging technology. We engage in R&D programs and projects for customers providing contract research and/or technology consultancy. To show our capability, we display demonstrator applications. This can inspire you to define next innovation. Our ISO7 cleanroom infrastructure and network in high tech industry provide excellent conditions to enable results. As a competent technology partner, DoMicro can support customers technology roadmap. The company delivers R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mold electronics, IC and MEMS integrations. Major Activities: outsourced innovative R&D projects - Flexible Hybrid Electronics - Inkjet printed electronics - Micro assembly technology - Advanced packaging Our approach is agile, flexible and dedicated. Let’s cross boundaries together, our dedicated and flexible team invites you: Do it ‘Do Micro’.

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