XTPL - Additive Manufacturing for Next-Generation Microelectronics

Ultra-Precise Dispensing (UPD) allows to form intricate structures with features as small as 1 μm, even on demanding substrate topographies, such as high vertical surfaces. It can handle materials with diverse viscosities, including dedicated nanoparticle-based highly conductive inks, such as silver, gold, copper, and third-party materials, such as epoxies, silicones, conductive adhesives, solder pastes and even quantum dots. It can efficiently replace wire bonding, offering superior resolution and packaging density with excellent high-frequency performance. The packaging capabilities can be further expanded by applying UPD for hybrid bonding, printing ultra-fine redistribution layers and over-the-edge interconnections. Ultra-Precise Dispensing can be also used for filling in the material in open-circuit defects, thus increasing yield and reducing waste in electronics manufacturing. The UPD technology allows for a wide variety of applications from in-house prototyping and small volume manufacturing to breakthroughs in device packaging approach implemented using industrial grade modular printheads.