POLA (Orientated Wire in Silicone)

POLA (Orientated Wire in Silicone)

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POLA (Orientated Wire in Silicone) is available in either solid silicone and fluorosilicone or silicone sponge with orientated wires in the z-direction, in aluminium, monel or phosphor bronze. This low-cost gasket solution allows EMI shielding by creating an electrical path between the mating surfaces via 400 contact points per square inch (6.2 per square mm). They are ideally used with compression stops to allow the correct deflection for optimal performance. Applications POLA Solid or POLA Sponge are composite electromagnetic interface (EMI) shielding and environmental sealing gasket materials, consisting of hundreds of individual fine wires embedded into the z-axis of solid or sponge elastomer. These products can easily be integrated into existing application assemblies, making the switch from a non-EMI solution possible. Available in various flat seal configurations (including sheets, strips and die-cut parts) with comparable performance at a fraction of the cost of alternative solutions that provide both EMI shielding and weather sealing performance, as well as the opportunity to exactly match the galvanic potential of interfacing aluminium surfaces. Providing total cost of ownership savings through price point and corrosion rework reductions. POLA Sponge also provides the opportunity for increased design leniencies such as thinner flange requirements and reduced fastener quantities. • Solid silicone binder: results in a robust gasketing material that can withstand greater fastener torque values as well as increased pressure and weather sealing requirements ​ • Silicone sponge: low-hardness closed cell that allows for reduced gasket load requirements to obtain weather sealing and EMI shielding performance ​ • Multiple wire alloy: allow for galvanic compatibility to be optimised between the gasketing and mating surfaces • Galvanic compatibility allows for optimised corrosion mitigation and avoidance of related rework costs ​
Product types
Additive manufacturingElectromechanical (enclosures, fans, relays, switches, transducers)Embedded systems (backplanes, board level, embedded systems hardware/tools, operating sytems)Interface/Interconnect (cables, connectors, imput devices)Semiconductors (analogue, ASSP, ASICS, DSP, memory, microcontrollers, microprocessors, programmable logic)

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