DDC - Bridging the Gap Between Air & Liquid Cooling
Wednesday, May 15, 2024 12:40 PM to 1:00 PM · 20 min. (Europe/Berlin)
Hall H, Booth L01
HPC Solutions Forum
Data Center Infrastructure and Cooling
Information
Cooling requirements, driven by HPC, AI and similar computationally intense workloads, are driving power densities within the data center to new heights, while airflow and temperature management at the server level are becoming more critical to hardware performance. These extreme changes have many operators scrambling to find a balanced way of managing a diverse mix of workloads within a single data center environment without stranding resources or overprovisioning.
In this session, we will explore how DDC S-Series Cabinet Technology is bridging the gap between air and liquid cooling by enabling data center owners and operators a simple and cost-effective way to manage variable density workloads in a single data center location with little to no disruption to the existing deployment.
The S-Series cabinet solution, with its precision airflow and temperature management capabilities, is an ideal way to build new data center space that is future-proofed to support anywhere from 0 to 85kW without the need for liquid cooling while it is equally capable of augmenting or retrofitting existing data centers to handle AI and other workloads at scale.
Whether you are looking to build or expand your data center or upgrade an existing site to support high-density workloads, DDC does so cost-effectively.
HPC Solutions Forum Questions
When is it worth it to invest in special architectures, versus sticking with industry standards?What can be done to make HPC and AI more efficient?
Format
On-site