Development of Water-Soluble Lift-Off Process for Chip Resistors

Development of Water-Soluble Lift-Off Process for Chip Resistors

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This project aims to replace the laser trimming method used in the manufacturing of chip resistors—a key surface-mount technology (SMT) component—with a more efficient, high-throughput process based on gravure offset printing. Currently, the internal resistive patterns of chip resistors are created via screen printing, but this method lacks the resolution needed for fine features. As a result, laser trimming is employed to finely adjust resistance values. However, laser trimming is slow and reduces productivity. To address this, Komori-Seria has received a request from A Taiwanese manufacturers to develop a gravure offset-based process that can directly print fine resistive patterns, eliminating the need for laser trimming. A water-soluble lift-off process is being developed as part of this solution, enabling precise pattern formation with improved efficiency and environmental compatibility. This shift promises: Higher productivity by removing the laser trimming step, Finer pattern resolution using gravure offset, Improved environmental performance through water-soluble materials.
Komori America CorporationKomori and Seria Corporation: Driving Innovation in Printed Electronics Seria Corporation has been a pioneer in printed circuit board (PCB) technology for nearly five decades, delivering the trusted SERIA brand of advanced screen-printing machines. Known for their precision, durability, and environmentally conscious design, Seria’s solutions meet the highest standards in quality, cost-efficiency, and safety. In 2014, Seria joined Komori Corporation, a global leader in printing technology. This strategic partnership has empowered both companies to expand their innovation footprint across printed electronics and semiconductor packaging. With a dedicated U.S. office offering responsive support, Komori/Seria now provides a robust portfolio of specialized equipment designed for both high-volume production and advanced R&D environments: Additive Manufacturing Equipment for R&D and Production Delivering high-precision, versatile systems tailored for both research laboratories and full-scale manufacturing. These solutions enable rapid innovation and prototyping in advanced electronics and material development. PE Gravure Offset Printing: Pioneering fine-line wiring, bump printing, and fanout technologies—offering scalable, sustainable solutions for semiconductor packaging, MicroLED displays, and other advanced applications. Fine & Selective Filling Printing Technology: Supporting next-generation semiconductor and PCB manufacturing, including HDI, UHDI, and interposer production, through highly selective, precision material deposition. High-Speed Screen-Printing Technology: Designed for gapless alignment and high-throughput efficiency in mass production of MLCCs, RFID tags, and other high-volume electronic components. These integrated technologies are shaping the future of printed electronics, delivering competitive advantages across automotive, consumer electronics, medical, aerospace, and IoT industries. As part of Komori, Seria remains true to its guiding philosophy: "Kando Beyond Expectations!" Together, they are redefining what's possible in printed and additive manufacturing, enabling flexible, cost-effective, and sustainable solutions across a broad spectrum of electronic applications.

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