Offset Printing Machines for Printed Electronics

Offset Printing Machines for Printed Electronics

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PEPIO F6/F12SC/F15 Semi-Automatic Gravure Offset Printing Machines The PEPIO F6, F12SC, and F15 semi-automatic gravure offset printing machines represent a breakthrough in precision and performance, designed for industries like semiconductor manufacturing, electronics, and advanced packaging. These machines deliver cutting-edge printing capabilities, focusing on ultra-fine resolution, accuracy, and high-speed performance. Whether in semiconductor ball mounting, flexible circuit printing, or microelectronics, the PEPIO series sets new standards in advanced printing technology. Key Features: Exceptional Precision: With a minimum line width of 5 µm and dot diameter as small as 5 µm, the PEPIO series ensures unmatched printing accuracy, with ± 5 µm precision within 300×300 mm. Alignment and Registration: Equipped with dual CCD cameras, the F6 and F15 ensure perfect alignment, even during high-speed production. High-Speed Flexibility: Printing speeds range from 2 mm/s to 200 mm/s, offering versatility for both small-batch precision and high-volume production. Vacuum Fixing System: The PEPIO F6 has a vacuum area of 150×150 mm, while the F12SC & F15 offers a larger 370×370 mm area, providing stable workpiece positioning for various materials. Semiconductor and Packaging Focus: Optimized for ball mounting and solder ball mounting in semiconductor packaging, ideal for developing 30 µm ball mounting technologies. Speed and Direction Control: Offers precise control down to 0.1 mm/s for coating and printing, with a right-to-left printing direction. Applications: Semiconductors: Ideal for ball mounting and solder ball mounting. Electronics & Optics: High-precision printing for flexible circuits. Packaging: Fine-line printing for labels and complex packaging. Why Choose PEPIO F6/F12SC/F15? With precision, advanced features, and versatility, the PEPIO series is the perfect solution for industries requiring top-tier performance.
Komori America CorporationKomori and Seria Corporation: Driving Innovation in Printed Electronics Seria Corporation has been a pioneer in printed circuit board (PCB) technology for nearly five decades, delivering the trusted SERIA brand of advanced screen-printing machines. Known for their precision, durability, and environmentally conscious design, Seria’s solutions meet the highest standards in quality, cost-efficiency, and safety. In 2014, Seria joined Komori Corporation, a global leader in printing technology. This strategic partnership has empowered both companies to expand their innovation footprint across printed electronics and semiconductor packaging. With a dedicated U.S. office offering responsive support, Komori/Seria now provides a robust portfolio of specialized equipment designed for both high-volume production and advanced R&D environments: Additive Manufacturing Equipment for R&D and Production Delivering high-precision, versatile systems tailored for both research laboratories and full-scale manufacturing. These solutions enable rapid innovation and prototyping in advanced electronics and material development. PE Gravure Offset Printing: Pioneering fine-line wiring, bump printing, and fanout technologies—offering scalable, sustainable solutions for semiconductor packaging, MicroLED displays, and other advanced applications. Fine & Selective Filling Printing Technology: Supporting next-generation semiconductor and PCB manufacturing, including HDI, UHDI, and interposer production, through highly selective, precision material deposition. High-Speed Screen-Printing Technology: Designed for gapless alignment and high-throughput efficiency in mass production of MLCCs, RFID tags, and other high-volume electronic components. These integrated technologies are shaping the future of printed electronics, delivering competitive advantages across automotive, consumer electronics, medical, aerospace, and IoT industries. As part of Komori, Seria remains true to its guiding philosophy: "Kando Beyond Expectations!" Together, they are redefining what's possible in printed and additive manufacturing, enabling flexible, cost-effective, and sustainable solutions across a broad spectrum of electronic applications.

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