Sumitomo Metal Mining - Development of nano copper powder with oxidation-resistant and air stable copper based MOD Paste for Printed Electronics
Thursday, December 11, 2025 12:30 PM to 12:50 PM · 20 min. (Africa/Abidjan)
Innovation Day December 2025
TechBlick Event
Information
We develop unique conductive materials for an energy-smart, sustainable world using our core technique. This talk introduces newly developed items, which are oxidation-resistant nano copper powder and MOD (metal-organic decomposition) paste for printed electronics. Our fine copper powder shows uniform size, strong oxidation resistance, and dense sintering near 200℃.
Also, MOD paste consists of MOD ink and its Cu powder to obtain film thickness—from thin lines to thick buses, over 3× typical nano inks—while keeping copper-like conductivity.
During curing, a protective layer forms on Cu, enabling reliable, low-resistance paths for high-current and large-area devices and compact modules. We aim to bring affordable, scalable copper printing to mainstream manufacturing.
Also, MOD paste consists of MOD ink and its Cu powder to obtain film thickness—from thin lines to thick buses, over 3× typical nano inks—while keeping copper-like conductivity.
During curing, a protective layer forms on Cu, enabling reliable, low-resistance paths for high-current and large-area devices and compact modules. We aim to bring affordable, scalable copper printing to mainstream manufacturing.
