Policrom Screens Spa - Innovation in TPU
Thursday, December 11, 2025 2:45 PM to 3:05 PM · 20 min. (Africa/Abidjan)
Innovation Day December 2025
TechBlick Event
Information
Printing electrical circuits on TPU (thermoplastic polyurethane) substrates opens the door to a wide range of applications in wearable and flexible electronics. Typically, though not exclusively, these circuits are transferred onto woven or nonwoven textiles, enabling functions such as signal transmission, stretch monitoring, heat transfer, and more.
The Challenges
Despite its potential, screen printing conductive and carbon inks on TPU presents significant difficulties:
• Printing process: TPU sheets often stick to the mesh or lift off the platen, disrupting the process.
• Curing phase: Exposure to the curing temperature compromises the flatness and dimensional accuracy of TPU, causing a total loss of image registration.
• Transfer to textile: During the final bonding step, the heat required to adhere the printed circuit to the textile softens the TPU, damaging the tracks and reducing conductivity.
These issues frequently lead to high scrap rates and, in many cases, make it impossible to produce a reliable circuit.
Our Solution:
To overcome these challenges, we have developed a dedicated product line and an application process that eliminate the critical issues of TPU printing and enable the production of multi-layer circuits.
This innovative material combines:
• A multilayer TPU film
• A heat-stabilized PET film
The lamination of these two components ensures perfect flatness and thermal stability, both essential for consistent and accurate printing results.
When used together with our encapsulant product, it becomes part of a system specifically designed for multi-layer electronic circuits, ensuring durability, reliability, and improved conductivity
The Challenges
Despite its potential, screen printing conductive and carbon inks on TPU presents significant difficulties:
• Printing process: TPU sheets often stick to the mesh or lift off the platen, disrupting the process.
• Curing phase: Exposure to the curing temperature compromises the flatness and dimensional accuracy of TPU, causing a total loss of image registration.
• Transfer to textile: During the final bonding step, the heat required to adhere the printed circuit to the textile softens the TPU, damaging the tracks and reducing conductivity.
These issues frequently lead to high scrap rates and, in many cases, make it impossible to produce a reliable circuit.
Our Solution:
To overcome these challenges, we have developed a dedicated product line and an application process that eliminate the critical issues of TPU printing and enable the production of multi-layer circuits.
This innovative material combines:
• A multilayer TPU film
• A heat-stabilized PET film
The lamination of these two components ensures perfect flatness and thermal stability, both essential for consistent and accurate printing results.
When used together with our encapsulant product, it becomes part of a system specifically designed for multi-layer electronic circuits, ensuring durability, reliability, and improved conductivity
