ruhlamat GmbH - Embedded wires for 3D formed electronics and smart surfaces
The Future of Electronics RESHAPED Berlin October 2025
TechBlick Event
Information
The evolution of electronics from rigid, planar circuits to flexible and three-dimensionally
shaped systems has opened new frontiers in product design, human–machine interaction,
and smart environments. Besides printed structures, one of the key enablers of this
transformation is the integration of embedded wiring within 3D-formed substrates, allowing
the seamless incorporation of electrical functionality into structural and aesthetic surfaces.
This presentation explores recent advancements in the development and manufacturing of
embedded wire technologies tailored for 3D-formed electronics and smart surfaces.
We delve into techniques such wire embedding for in-mold electronics (IME) and 3D
molded devices as well as other aspects like additive manufacturing, and thermoforming-
compatible conductive traces, focusing on their capacity to deliver reliable
interconnections within curved or irregular geometries.
Applications discussed include automotive and consumer electronics, where embedded
3D wiring enables enhanced ergonomics, user interfaces, and unobtrusive sensor
integration. The presentation concludes with a review of current challenges and looks ahead
to emerging innovations on multifunctional smart skins as well as the hybrid use of wire
conductors in combination with printed electronics.
By bridging the gap between electronics and industrial design, embedded wires in 3D-formed
electronics represent a paradigm shift toward more intuitive, connected, and aesthetically
integrated smart surfaces.
shaped systems has opened new frontiers in product design, human–machine interaction,
and smart environments. Besides printed structures, one of the key enablers of this
transformation is the integration of embedded wiring within 3D-formed substrates, allowing
the seamless incorporation of electrical functionality into structural and aesthetic surfaces.
This presentation explores recent advancements in the development and manufacturing of
embedded wire technologies tailored for 3D-formed electronics and smart surfaces.
We delve into techniques such wire embedding for in-mold electronics (IME) and 3D
molded devices as well as other aspects like additive manufacturing, and thermoforming-
compatible conductive traces, focusing on their capacity to deliver reliable
interconnections within curved or irregular geometries.
Applications discussed include automotive and consumer electronics, where embedded
3D wiring enables enhanced ergonomics, user interfaces, and unobtrusive sensor
integration. The presentation concludes with a review of current challenges and looks ahead
to emerging innovations on multifunctional smart skins as well as the hybrid use of wire
conductors in combination with printed electronics.
By bridging the gap between electronics and industrial design, embedded wires in 3D-formed
electronics represent a paradigm shift toward more intuitive, connected, and aesthetically
integrated smart surfaces.
