Silicon Austria Labs GmbH - Life Cycle Assessment of Printed Electronics: Challenges, Insights and Opportunities

This masterclass provides an introduction to conducting Life Cycle Assessments (LCA) in the context of printed electronics, using real-world examples from disposable sensor applications such as point-of-care diagnostics and smart packaging. The session will cover key methodological choices, such as defining appropriate system boundaries, interpreting data, and considering end-of-life scenarios.

Key findings from our recent research will be presented, highlighting environmental hotspots, the influence of material selection, and current methodological limitations of LCA. The session concludes with a discussion of scientific strategies to tackle these challenges, including design-for-recycling concepts, modular architectures, and the use of alternative or bio-based materials to support more sustainable development in printed electronics