

Heraeus Electronics - Bridging the Gap Between Additive and Subtractive Technologies: the Solderable Polymer Revolution.
The Future of Electronics RESHAPED Berlin October 2025
TechBlick Event
Information
Polymer thick-film (PTF) technology has long been a foundational element in the fabrication of low-cost, flexible electronic circuits, particularly where substrate temperature limitations exist. Despite its advantages—low-temperature processability and compatibility with flexible substrates—traditional PTF conductors have faced major adoption barriers due to their poor solderability and reduced thermal stability.
Representing a significant leap forward in the diminishing line between additive and subtractive technology, Heraeus will lead a discussion surrounding how the implementation of solderable polymer thick film into additive applications helps to accelerate a future moving away from the cost heavy and negative environmental impact manufacturing process of subtractive technology.
Representing a significant leap forward in the diminishing line between additive and subtractive technology, Heraeus will lead a discussion surrounding how the implementation of solderable polymer thick film into additive applications helps to accelerate a future moving away from the cost heavy and negative environmental impact manufacturing process of subtractive technology.
