Holst Centre - Recyclability of In-Mold Electronics

Hybrid & Printed Electronics (HPE) offer many advantages compared to conventional printed circuitry boards (PCBs), including reduced thickness and weight, increased freedom of design and form, simplified product integration, wear comfort and conformability, the use of recyclable thermoplastics, and additive printing of metal circuitry. A direct comparison of HPE- and PCB-based electronics at product level reveals that HPE indeed poses a lower environmental burden. Moreover, several circular practices may be used to further build on this first favourable outcome. At present, most HPE is not readily recycled, in part due to their unique selling points. HPE typically contains less (printed) metal than PCBs, making recycling of these metallized plastics less attractive for recyclers. Furthermore, the seamless integration of metals, semiconductor components and plastics increases the complexity of material salvation at end-of-life. This is especially the case with In-Mold Electronics, where the circuitry and components are over-moulded with a thermoplastic encapsulation. Our presentation will elaborate on our closed-loop recycling approach with high yields for plastics, metals, and embedded components.