Holst Centre - High Precision at Light Speed: Laser-Assisted Die-to-Wafer Assembly for microLEDs and Integrated Photonics

Holst Centre has developed an innovative and proprietary release stack that enables the rapid release of microcomponents with adaptive pitch and high selectivity using a low-cost laser source. Our technology demonstrates exceptional scalability and flexibility, allowing for the transfer of both mini- and microLEDs. In our R&D environment at Holst Centre, we achieved submicron transfer precision with a yield exceeding 99.9% on a sample set of over ten thousand microLEDs. This advancement is compatible with die-on-demand release from ultrahigh-density wafers, achieving edge-to-edge die spacing as small as just a few micrometers.



In addition to ultrasmall microcomponents, we have also applied our release concept to thin sub-mm components, such as Indium Phosphide (InP) coupons for integrated photonics. In our R&D environment, we demonstrated a transfer precision of less than 0.5 microns for InP coupons that are only a few micrometers thick, with aspect ratios of up to 10.