Semilab - High-throughput photoluminescence-based optical inspection for MicroLED wafers
MicroLED/AR/VR Connect September 2025
TechBlick Event
Information
Yield management plays a pivotal role in reaching high-volume microLED manufacturing capability. Yield is a key element in manufacturing cost and its control requires full-wafer inspection, where each microLED device is individually measured. On the other hand, the display industry is driving for an ever-decreasing device size. Current GaN/InGaN microLEDs have typical characteristic dimensions of 1-10 micrometer. These two requirements mean that there is a need for fast and accurate inspection metrologies for microLED characterization.
We present a high-throughput and high spatial- and spectral resolution photoluminescence-based optical inspection system, capable of simultaneously reporting the light emission intensity and spectral peak wavelengths of all microLEDs on a wafer. Spatial resolution down to 0.5 micrometer, emission wavelength accuracy below 2 nm, and robust segmentation-based image analysis are demonstrated.
We present a high-throughput and high spatial- and spectral resolution photoluminescence-based optical inspection system, capable of simultaneously reporting the light emission intensity and spectral peak wavelengths of all microLEDs on a wafer. Spatial resolution down to 0.5 micrometer, emission wavelength accuracy below 2 nm, and robust segmentation-based image analysis are demonstrated.
