

The next challenges in thermal management
Wednesday, May 24, 2023 1:20 PM to 1:40 PM · 20 min. (Europe/Berlin)
Hall H, Booth K1001 - Ground Floor
HPC Solutions Forum
Exascale SystemsSustainability and Energy Efficiency
Information
Liquid cooling has become an increasingly popular solution for managing heat in high-performance computing systems, such as super computer & data centers.
While liquid cooling can offer superior thermal performance compared to traditional air-cooled systems, it also poses some challenges as requirements in thermal management are getting higher and higher.
This is translated by a need for higher cooling flow rates and therefore find appropriate connection solutions, since the need of the hot swappable system is mandatory.
Modularity is becoming a key to adapt quickly installation to the thermal challenges, and quick couplings are a key component of this trend .
In parallel to the different developments in liquid cooling, we will discuss some research made with refrigerant fluid , still in line with the increased demand for more thermal efficiency.
HPC Solutions Forum Topics
The next innovation: What will be the big news at ISC 2033? Be as specific as you can.
Format
On-site
Intermediate Level
100%