Agenda

Track
- 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
- 03. Integrating Photonics & Wireless in Electrical Design
- 04. Advances in Materials & Processing for PCBs, Modules & Packages
- 06. System Co-Design: Modeling, Simulation & Measurement Validation
- 07. Optimizing High-Speed Link Design
- 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER
- 09. High-Speed Signal Processing, Equalization & Coding/FEC
- 09. High-Speed Signal Processing, Equalization & Coding/FEC
- 10. Power Integrity in Power Distribution Networks
- 10. Power Integrity in Power Distribution Networks
- 12. Applying Test & Measurement Methodology
- 13. Modeling & Analysis of Interconnects
- 13. Modeling & Analysis of Interconnects
- 14. Machine Learning for Microelectronics, Signaling & System Design
- 14. Machine Learning for Microelectronics, Signaling & System Design
- Chiphead Theater
- Drive World - Advanced Automotive
- Embedded IoT World
- Keynote
- Sponsored Session
- Networking Session
Primary Theme
- 5G
- Automotive
- Autonomous
- Consumer Electronics
- Data Centers
- High-speed Communications
- Infrastructure
- Internet of Things (IoT)
- Security
- Sensing/Vision Systems
Secondary Theme
- Automotive
- Autonomous
- Data Centers
- High-speed Communications
- Infrastructure
- Security
- Sensing/Vision Systems
Format
- Tutorial
- Chiphead Theater
- Keynote
- Technical Session
- Panel Discussion
- Embedded IoT World Session
- Sponsored Session
- Networking Session

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