Preventing Electrostatic Damage with Effective and Circular-Economy Friendly Protection

Paper ID: C2025-00360 ABSTRACT: Damage from ESD (Electrostatic Discharge) is a major cost to the microcircuit industry and electronic parts in terms of time, money, and mission risk. Worse, ESD damage can easily go undetected [1]. Our modern life is inherently and increasingly tied to sophisticated and costly electronic components, such as in AI exploration, data centers, robotics, video game consoles, and electrical vehicles, to name just a few. The storage and transportation of these vast amounts of electronic components require sound packaging design to ensure their integrity. Common packaging materials use petroleum based plastic media, which after usage result in vast amount of landfill waste. Presented here is an eco-friendly packaging material that provides ESD and corrosion protection to electronic components during storage and transportation, using renewable paper substrate. Its ESD protection meets the requirements of ANSI/ESD STM11.11 and MIL-STD 3010C Method 4046, its vapor corrosion protection meets NACE Standard TM0208. When taken out of this package material, the functions of the parts will not be affected and can be used as usual. After usage, this ESD protective packaging can be easily recycled into paper waste stream, not to a landfill. This material is also biodegradable.